PDM41532SA20TATY vs IS62UP6416SL-100BI feature comparison

PDM41532SA20TATY IXYS Corporation

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IS62UP6416SL-100BI Integrated Silicon Solution Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IXYS CORP INTEGRATED SILICON SOLUTION INC
Part Package Code TSOP2 BGA
Package Description TSOP2, MINI, BGA-48
Pin Count 44 48
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 100 ns
JESD-30 Code R-PDSO-G44 R-PBGA-B48
Length 18.41 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm
Base Number Matches 1 1
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare PDM41532SA20TATY with alternatives

Compare IS62UP6416SL-100BI with alternatives