PDM31256SA15TTR
vs
WS512K32-25G2TIA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
IXYS CORP
|
MERCURY SYSTEMS INC
|
Part Package Code |
TSOP
|
|
Package Description |
PLASTIC, TSOP1-28
|
,
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
15 ns
|
25 ns
|
JESD-30 Code |
R-PDSO-G28
|
S-CQMA-G68
|
Length |
11.8 mm
|
|
Memory Density |
262144 bit
|
16777216 bit
|
Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
Memory Width |
8
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
68
|
Number of Words |
32768 words
|
524288 words
|
Number of Words Code |
32000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
32KX8
|
512KX32
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
TSOP1
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.55 mm
|
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
8 mm
|
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
USER CONFIGURABLE AS 2M X 8
|
Alternate Memory Width |
|
16
|
|
|
|
Compare PDM31256SA15TTR with alternatives
Compare WS512K32-25G2TIA with alternatives