PCX755BVGS350LE vs XPC755BRX350LB feature comparison

PCX755BVGS350LE Teledyne e2v

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XPC755BRX350LB Motorola Semiconductor Products

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD MOTOROLA INC
Part Package Code CGA
Package Description BGA, BGA,
Pin Count 360
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.08 mm 3.2 mm
Speed 350 MHz 350 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.8 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2

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