XPC755BRX350LB
vs
PC755BVZF350LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
E2V TECHNOLOGIES PLC
Package Description
BGA,
BGA, BGA360,19X19,50
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-PBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.2 mm
2.77 mm
Speed
350 MHz
350 MHz
Supply Voltage-Max
2.1 V
2.1 V
Supply Voltage-Min
1.9 V
1.8 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
Part Package Code
BGA
Pin Count
360
Operating Temperature-Max
110 °C
Operating Temperature-Min
40 °C
Package Equivalence Code
BGA360,19X19,50
Compare XPC755BRX350LB with alternatives
Compare PC755BVZF350LE with alternatives