PCK2002MDB
vs
ICS662M-03TR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SSOP
|
SOIC
|
| Package Description |
SSOP, SSOP28,.3
|
SOP,
|
| Pin Count |
28
|
8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
PCK2000
|
662
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G8
|
| Length |
10.2 mm
|
4.9 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
28
|
8
|
| Number of True Outputs |
10
|
1
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SOP
|
| Package Equivalence Code |
SSOP28,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Prop. Delay@Nom-Sup |
3.5 ns
|
|
| Propagation Delay (tpd) |
3.5 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.25 ns
|
|
| Seated Height-Max |
2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
20
|
| Width |
5.3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare PCK2002MDB with alternatives
Compare ICS662M-03TR with alternatives