PCI6612GHK vs PCI7412ZHK feature comparison

PCI6612GHK Texas Instruments

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PCI7412ZHK Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LFBGA, GREEN, PLASTIC, MICRO BGA-216
Pin Count 216 216
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bus Compatibility PCI PCI
Clock Frequency-Max 24.576 MHz 24.576 MHz
Data Transfer Rate-Max 132 MBps 132 MBps
Drive Interface Standard IEEE1394; IEEE1394A IEEE1394; IEEE1394A
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B216 S-PBGA-B216
Length 16 mm 16 mm
Number of Terminals 216 216
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 16 mm 16 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Texas Instruments
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare PCI6612GHK with alternatives

Compare PCI7412ZHK with alternatives