PCI1510ZGU
vs
PCI1520IGHKEP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA, BGA144,13X13,32
|
PLASTIC, BGA-209
|
Pin Count |
144
|
209
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Address Bus Width |
32
|
32
|
Bus Compatibility |
PCI
|
PCI
|
Clock Frequency-Max |
33 MHz
|
33.33 MHz
|
Data Transfer Rate-Max |
130 MBps
|
16.25 MBps
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B209
|
JESD-609 Code |
e1
|
e0
|
Length |
12 mm
|
16 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
144
|
209
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA144,13X13,32
|
BGA209,19X19,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
220
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
12 mm
|
16 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCMCIA
|
BUS CONTROLLER, PCMCIA
|
Base Number Matches |
1
|
1
|
Drive Interface Standard |
|
IEEE 1394
|
|
|
|
Compare PCI1510ZGU with alternatives
Compare PCI1520IGHKEP with alternatives