PCI1510RZVF
vs
PCI1221PDV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
QFP
Package Description
LFBGA, BGA253,19X19,32
PLASTIC, QFP-208
Pin Count
253
208
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
32
Bus Compatibility
PCI
PCI
Clock Frequency-Max
33 MHz
33.33 MHz
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B253
S-PQFP-G208
Length
16 mm
28 mm
Number of Terminals
253
208
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFQFP
Package Equivalence Code
BGA253,19X19,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.4 mm
1.6 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
16 mm
28 mm
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCMCIA
BUS CONTROLLER, PCMCIA
Base Number Matches
1
2
Data Transfer Rate-Max
130 MBps
JESD-609 Code
e0
Moisture Sensitivity Level
NOT SPECIFIED
Terminal Finish
TIN LEAD
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