PCF8566TD
vs
PCF8566TD-T
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Display Mode
SEGMENT
SEGMENT
JESD-30 Code
R-PDSO-G40
R-PDSO-G40
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
1
Number of Segments
24
24
Number of Terminals
40
40
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SOP40,.5,30
SOP40,.5,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
240
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.09 mA
0.09 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2