PCF85263ATL/AX
vs
PCF85263AT/AJ
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
DFN
|
SOIC
|
Pin Count |
10
|
8
|
Manufacturer Package Code |
SOT1197-1
|
SOT96-1
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
15 Weeks
|
17 Weeks, 3 Days
|
Samacsys Manufacturer |
NXP
|
NXP
|
Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
External Data Bus Width |
|
|
Information Access Method |
SERIAL(I2C)
|
SERIAL(I2C)
|
Interrupt Capability |
Y
|
Y
|
JESD-30 Code |
S-PDSO-N10
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Length |
2.6 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
10
|
8
|
Number of Timers |
|
|
On Chip Data RAM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
SOP
|
Package Equivalence Code |
SOLCC10,.11,20
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
RAM (words) |
1
|
1
|
Seated Height-Max |
0.5 mm
|
1.75 mm
|
Supply Current-Max |
0.000885 mA
|
0.000885 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
0.9 V
|
0.9 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time-Min |
SECONDS
|
SECONDS
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Volatile |
NO
|
NO
|
Width |
2.6 mm
|
3.9 mm
|
uPs/uCs/Peripheral ICs Type |
TIMER, REAL TIME CLOCK
|
TIMER, REAL TIME CLOCK
|
Base Number Matches |
1
|
1
|
|
|
|