PCF5271CVM100
vs
GD80960JS-33
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
INTEL CORP
Part Package Code
BGA
BGA
Package Description
MAPBGA-196
BGA, BGA196(UNSPEC)
Pin Count
196
196
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
33.3 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
1
Number of Terminals
196
196
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA196,14X14,40
BGA196(UNSPEC)
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Speed
100 MHz
33 MHz
Supply Voltage-Max
1.65 V
3.45 V
Supply Voltage-Min
1.35 V
3.15 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Additional Feature
OPERATING CASE TEMPERATURE 0 TO 100 C
Supply Current-Max
250 mA
Compare PCF5271CVM100 with alternatives
Compare GD80960JS-33 with alternatives