PCF5271CVM100
vs
MCF5272VM66
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
BGA, BGA196,14X14,40
|
PLASTIC, BGA-196
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
32
|
32
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA196,14X14,40
|
BGA196,14X14,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
100 MHz
|
66 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
196
|
| ECCN Code |
|
3A991.A.2
|
| Samacsys Manufacturer |
|
NXP
|
| Address Bus Width |
|
23
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
66 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-609 Code |
|
e1
|
| Length |
|
15 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
15 mm
|
|
|
|
Compare MCF5272VM66 with alternatives