PCA9517AD
vs
PCA9517ATP
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP8,.25
|
HVSON,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
0.8 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
0.9 V
|
0.9 V
|
| Supply Voltage-Nom |
1.2 V
|
3.3 V
|
| Supply Voltage1-Max |
5.5 V
|
|
| Supply Voltage1-Min |
2.7 V
|
|
| Supply Voltage1-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
2 mm
|
| Base Number Matches |
9
|
2
|
| Additional Feature |
|
OPERATES WITH 2.7 V TO 5.5 V
|
|
|
|
Compare PCA9517AD with alternatives
Compare PCA9517ATP with alternatives