PC755MZF300LE vs PC755CVZFU300LE feature comparison

PC755MZF300LE Teledyne e2v

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PC755CVZFU300LE Atmel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer E2V TECHNOLOGIES PLC ATMEL CORP
Part Package Code BGA BGA
Package Description BGA, BGA, BGA360,16X16,50
Pin Count 360 360
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B360 S-PBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.77 mm 2.77 mm
Speed 300 MHz 300 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Rohs Code No
Package Equivalence Code BGA360,16X16,50

Compare PC755MZF300LE with alternatives

Compare PC755CVZFU300LE with alternatives