PC755MZF300LE
vs
PC755CVZFU300LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
E2V TECHNOLOGIES PLC
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA360,16X16,50
Pin Count
360
360
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B360
S-PBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.77 mm
2.77 mm
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.1 V
2.1 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Rohs Code
Package Equivalence Code
BGA360,16X16,50
Compare PC755MZF300LE with alternatives
Compare PC755CVZFU300LE with alternatives