Findchips: Compare PC755BVGH350LE vs PCX755BMGHU350LE

PC755BVGH350LE vs PCX755BMGHU350LE feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	TELEDYNE E2V (UK) LTD	TELEDYNE E2V (UK) LTD
Part Package Code	BGA	BGA
Package Description	BGA-360	BGA,
Pin Count	360	360
Reach Compliance Code	compliant	compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Additional Feature	ALSO REQUIRES 3.3V SUPPLY
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	100 MHz	100 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-B360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Operating Temperature-Max	110 °C	125 °C
Operating Temperature-Min	40 °C	-55 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	BGA
Package Equivalence Code	BGA360,19X19,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.24 mm	3.24 mm
Speed	350 MHz	350 MHz
Supply Voltage-Max	2.1 V	2.1 V
Supply Voltage-Min	1.8 V	1.8 V
Supply Voltage-Nom	2 V	2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	2	1
Temperature Grade		MILITARY
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors