Findchips: Compare PC755BMGHU350LE vs TSXPC750AMGSB/T12LE

PC755BMGHU350LE vs TSXPC750AMGSB/T12LE feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	ATMEL CORP	ATMEL CORP
Part Package Code	BGA	CGA
Package Description	BGA,	CGA,
Pin Count	360	360
Reach Compliance Code	unknown	compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	100 MHz	83.3 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-CBGA-B360	S-CBGA-C360
Length	25 mm	25 mm
Low Power Mode	YES	YES
Number of Terminals	360	360
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	BGA	CGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.24 mm	4.2 mm
Speed	350 MHz	266 MHz
Supply Voltage-Max	2.1 V	2.7 V
Supply Voltage-Min	1.8 V	2.5 V
Supply Voltage-Nom	2 V	2.6 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	BALL	C BEND
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1
Rohs Code		No
Screening Level		MIL-STD-883
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors