Part Details for PC745BVZFU300LE by Atmel Corporation
Overview of PC745BVZFU300LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for PC745BVZFU300LE
PC745BVZFU300LE CAD Models
PC745BVZFU300LE Part Data Attributes
|
|
PC745BVZFU300LE
Atmel Corporation
Buy Now
Datasheet
|
Compare Parts:
PC745BVZFU300LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255
|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA255,16X16,50 | |
| Pin Count | 255 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B255 | |
| JESD-609 Code | e0 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA255,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.8 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC745BVZFU300LE
This table gives cross-reference parts and alternative options found for PC745BVZFU300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC745BVZFU300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC745BPX300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255 | NXP Semiconductors | PC745BVZFU300LE vs MPC745BPX300 |
| IBM25PPC740L-GB300A2T | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | IBM | PC745BVZFU300LE vs IBM25PPC740L-GB300A2T |
| PC745CVZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP-CHIP, PLASTIC, BGA-360 | Teledyne e2v | PC745BVZFU300LE vs PC745CVZFU300LE |
| MPC745BVT300LE | GF REV2.8,105C ,PB FREE | Freescale Semiconductor | PC745BVZFU300LE vs MPC745BVT300LE |
| PC745BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 | Thales Group | PC745BVZFU300LE vs PC745BVZFU300LD |
| PC745VGHU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | Teledyne e2v | PC745BVZFU300LE vs PC745VGHU300LE |
| IBM25PPC740L-GB300A2R | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | IBM | PC745BVZFU300LE vs IBM25PPC740L-GB300A2R |
| PCX745BVZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 | Atmel Corporation | PC745BVZFU300LE vs PCX745BVZFU300LE |
| XPC745BPX300LE | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,255PIN,PLASTIC | Freescale Semiconductor | PC745BVZFU300LE vs XPC745BPX300LE |
| PCX745MGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | Teledyne e2v | PC745BVZFU300LE vs PCX745MGH300LE |