PC7457MGH1000NC vs MC7457VG1000LC feature comparison

PC7457MGH1000NC Teledyne e2v

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MC7457VG1000LC NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-483
Pin Count 483
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 1.3V SUPPLY
Address Bus Width 36 36
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 167 MHz 167 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B483 S-CBGA-B483
Length 29 mm 29 mm
Low Power Mode YES YES
Number of Terminals 483 483
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.2 mm 3.2 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.15 V 1.35 V
Supply Voltage-Min 1.05 V 1.25 V
Supply Voltage-Nom 1.1 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer NXP
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Gold (Ni/Au)
Time@Peak Reflow Temperature-Max (s) 40

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