PC7410MGH400LE
vs
PCX7410MGU400LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
E2V TECHNOLOGIES PLC
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA360,19X19,50
BGA,
Pin Count
360
360
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
400 MHz
400 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Length
25 mm
Seated Height-Max
3.2 mm
Width
25 mm
Compare PC7410MGH400LE with alternatives
Compare PCX7410MGU400LE with alternatives