PALCE22V10H-25PC/4
vs
GAL22V10C-25LD/883
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
LATTICE SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.3
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK
10 LOGIC OUTPUT MACROCELL
Architecture
PAL-TYPE
Clock Frequency-Max
33.3 MHz
25 MHz
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Length
30.734 mm
31.875 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Number of Terminals
24
24
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
4
1
ECCN Code
3A001.A.2.C
Compare PALCE22V10H-25PC/4 with alternatives
Compare GAL22V10C-25LD/883 with alternatives