GAL22V10C-25LD/883
vs
ATF22V10BQL-25GM/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
ATMEL CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP24,.3
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
10 LOGIC OUTPUT MACROCELL
Clock Frequency-Max
25 MHz
33.3 MHz
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Length
31.875 mm
32 mm
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Programmable Logic Type
EE PLD
FLASH PLD
Propagation Delay
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Rohs Code
No
Architecture
PAL-TYPE
JESD-609 Code
e0
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Screening Level
MIL-STD-883
Terminal Finish
Tin/Lead (Sn/Pb)
Compare GAL22V10C-25LD/883 with alternatives
Compare ATF22V10BQL-25GM/883 with alternatives