PAL16L8A-2DMB vs PAL16R6A-2CNSTD feature comparison

PAL16L8A-2DMB Cypress Semiconductor

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PAL16R6A-2CNSTD AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Package Description DIP, DIP20,.3 DIP,
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE
JESD-30 Code R-XDIP-T20 R-PDIP-T20
JESD-609 Code e0
Number of Inputs 16
Number of Outputs 8
Number of Product Terms 64
Number of Terminals 20 20
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Output Function COMBINATORIAL MIXED
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type EE PLD OT PLD
Propagation Delay 40 ns 35 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 20
Clock Frequency-Max 16 MHz
Length 25.908 mm
Number of Dedicated Inputs 8
Number of I/O Lines 2
Organization 8 DEDICATED INPUTS, 2 I/O
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.81 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare PAL16L8A-2DMB with alternatives

Compare PAL16R6A-2CNSTD with alternatives