PAL12L10JC vs PAL12L10MJS883B feature comparison

PAL12L10JC National Semiconductor Corporation

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PAL12L10MJS883B Monolithic Memories (RETIRED)

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MONOLITHIC MEMORIES
Package Description DIP, DIP24,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ACTIVE LOW OUTPUT
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-GDIP-T24 R-XDIP-T24
JESD-609 Code e0 e0
Number of Dedicated Inputs 12
Number of I/O Lines
Number of Inputs 12 12
Number of Outputs 10 10
Number of Product Terms 20 20
Number of Terminals 24 24
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 12 DEDICATED INPUTS, 0 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 40 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B

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Compare PAL12L10MJS883B with alternatives