PAL12L10JC vs PAL12L10ANC feature comparison

PAL12L10JC National Semiconductor Corporation

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PAL12L10ANC Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ACTIVE LOW OUTPUT ACTIVE LOW OUTPUT
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-GDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Number of Dedicated Inputs 12 12
Number of I/O Lines
Number of Inputs 12 12
Number of Outputs 10 10
Number of Product Terms 20 20
Number of Terminals 24 24
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 12 DEDICATED INPUTS, 0 I/O 12 DEDICATED INPUTS, 0 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 40 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 3
Length 31.915 mm

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Compare PAL12L10ANC with alternatives