PAL10H8MJ883B vs PAL10H8-2MJ883B feature comparison

PAL10H8MJ883B Monolithic Memories (RETIRED)

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PAL10H8-2MJ883B Monolithic Memories (RETIRED)

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MONOLITHIC MEMORIES MONOLITHIC MEMORIES
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-XDIP-T20 R-XDIP-T20
JESD-609 Code e0 e0
Number of Inputs 10 10
Number of Outputs 8 8
Number of Product Terms 16 16
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 45 ns 80 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1

Compare PAL10H8MJ883B with alternatives

Compare PAL10H8-2MJ883B with alternatives