PAL10H8-2MJ883B vs PAL10H8-2CJ feature comparison

PAL10H8-2MJ883B

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PAL10H8-2CJ AMD

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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description DIP, DIP20,.3
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Architecture PAL-TYPE
JESD-30 Code R-XDIP-T20
JESD-609 Code e0
Number of Inputs 10
Number of Outputs 8
Number of Product Terms 16
Number of Terminals 20
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Function COMBINATORIAL
Package Body Material CERAMIC
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Programmable Logic Type OT PLD
Propagation Delay 60 ns
Qualification Status Not Qualified
Supply Voltage-Nom 5 V
Surface Mount NO
Technology TTL
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 1

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