PACE1757M-35QGMB vs SCF5250LAG100 feature comparison

PACE1757M-35QGMB Pyramid Semiconductor Corporation

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SCF5250LAG100 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PERFORMANCE SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code QFP
Package Description QFP, 20 X 20 MM, 1.40 MM THICKNESS, 0.50 MM PITCH, LEAD FREE, QFP-144
Pin Count 144
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 25
Bit Size 16 32
Boundary Scan NO YES
Clock Frequency-Max 35 MHz 33.86 MHz
External Data Bus Width 16 32
Format FLOATING POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-XQFP-G144 S-PQFP-G144
Length 29.21 mm 20 mm
Low Power Mode YES YES
Number of DMA Channels
Number of External Interrupts 8
Number of Serial I/Os
Number of Terminals 144 144
On Chip Data RAM Width
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code QFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 4.953 mm 1.6 mm
Speed 35 MHz 100 MHz
Supply Current-Max 325 mA
Supply Voltage-Max 5.5 V 1.32 V
Supply Voltage-Min 4.5 V 1.08 V
Supply Voltage-Nom 5 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.6 mm 0.5 mm
Terminal Position QUAD QUAD
Width 29.21 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Rohs Code Yes
Factory Lead Time 4 Weeks
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

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