PACE1757M-35QGMB vs PACE1757M-40QLC feature comparison

PACE1757M-35QGMB Pyramid Semiconductor Corporation

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PACE1757M-40QLC Pyramid Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PERFORMANCE SEMICONDUCTOR CORP PERFORMANCE SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description QFP, QFF,
Pin Count 144 144
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 40
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 35 MHz 40 MHz
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G144 S-PQFP-F144
Length 29.21 mm 29.21 mm
Low Power Mode YES YES
Number of DMA Channels 1
Number of External Interrupts 8 8
Number of Serial I/Os
Number of Terminals 144 144
On Chip Data RAM Width
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFF
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 4.953 mm 3.556 mm
Speed 35 MHz 40 MHz
Supply Current-Max 325 mA 340 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form GULL WING FLAT
Terminal Pitch 0.6 mm 0.6 mm
Terminal Position QUAD QUAD
Width 29.21 mm 29.21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Additional Feature 2.5 MIPS USAF DAIS MIX

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