PACE1757M-20QGC
vs
IDT79RC32V364-100DAI8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
PERFORMANCE SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
QFP,
20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
Pin Count
144
144
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
40
32
Bit Size
16
32
Boundary Scan
NO
YES
Clock Frequency-Max
20 MHz
50 MHz
External Data Bus Width
16
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
Length
29.21 mm
20 mm
Low Power Mode
YES
YES
Number of DMA Channels
1
Number of External Interrupts
8
Number of Serial I/Os
Number of Terminals
144
144
On Chip Data RAM Width
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.953 mm
1.6 mm
Speed
20 MHz
100 MHz
Supply Current-Max
280 mA
Supply Voltage-Max
5.5 V
3.465 V
Supply Voltage-Min
4.5 V
3.135 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.6 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
29.21 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Compare PACE1757M-20QGC with alternatives
Compare IDT79RC32V364-100DAI8 with alternatives