IDT79RC32V364-100DAI8 vs IDT79RC32V364-100DAGI feature comparison

IDT79RC32V364-100DAI8 Integrated Device Technology Inc

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IDT79RC32V364-100DAGI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
Pin Count 144 144
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PQFP-G144 S-PQFP-G144
JESD-609 Code e0 e3
Length 20 mm 20 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 144 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 100 MHz 100 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare IDT79RC32V364-100DAI8 with alternatives

Compare IDT79RC32V364-100DAGI with alternatives