P89LPC932A1FA,129 vs P89LPC932A1FHN feature comparison

P89LPC932A1FA,129 NXP Semiconductors

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P89LPC932A1FHN NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC QFN
Package Description PLASTIC, MS-018, SOT-261-2, LCC-28 6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-788-1, HVQFN-28
Pin Count 28 28
Manufacturer Package Code SOT261-2
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQCC-J28 S-PQCC-N28
JESD-609 Code e3 e4
Length 11.505 mm 6 mm
Moisture Sensitivity Level 1 1
Number of I/O Lines 26 26
Number of Terminals 28 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ HVQCCN
Package Equivalence Code LDCC28,.5SQ LCC28,.24SQ,25
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 768 768
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 4.57 mm 1 mm
Speed 12 MHz 12 MHz
Supply Current-Max 18 mA 18 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form J BEND NO LEAD
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position QUAD QUAD
Width 11.505 mm 6 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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