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P89LPC932A1FA,129 vs P89LPC932A1FA,112 feature comparison

P89LPC932A1FA,129 NXP Semiconductors

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P89LPC932A1FA,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC LCC
Package Description PLASTIC, MS-018, SOT-261-2, LCC-28 PLASTIC, MS-018, SOT-261-2, LCC-28
Pin Count 28 28
Manufacturer Package Code SOT261-2 SOT261-2
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQCC-J28 S-PQCC-J28
JESD-609 Code e3 e3
Length 11.505 mm 11.505 mm
Moisture Sensitivity Level 1 1
Number of I/O Lines 26 26
Number of Terminals 28 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC28,.5SQ LDCC28,.5SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (bytes) 768 768
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 4.57 mm 4.57 mm
Speed 12 MHz 12 MHz
Supply Current-Max 18 mA 18 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.505 mm 11.505 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Samacsys Manufacturer NXP
Peak Reflow Temperature (Cel) 245
Microcontrollers and Processors » Microcontrollers
Microcontrollers and Processors » Microcontrollers

Compare P89LPC932A1FA,129 with alternatives

Compare P89LPC932A1FA,112 with alternatives