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P89LPC932A1FA,129 vs P89LPC9321FN,112 feature comparison

P89LPC932A1FA,129 NXP Semiconductors

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P89LPC9321FN,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC DIP
Package Description PLASTIC, MS-018, SOT-261-2, LCC-28 0.600 INCH, PLASTIC, MS-015, SOT117-1, DIP-28
Pin Count 28 28
Manufacturer Package Code SOT261-2 SOT117-1
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 12 MHz 18 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQCC-J28 R-PDIP-T28
JESD-609 Code e3 e3
Length 11.505 mm 35.5 mm
Moisture Sensitivity Level 1
Number of I/O Lines 26 26
Number of Terminals 28 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC28,.5SQ DIP28,.6
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 768 768
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 4.57 mm 5.1 mm
Speed 12 MHz 18 MHz
Supply Current-Max 18 mA 23 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN MATTE TIN
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.505 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
Microcontrollers and Processors » Microcontrollers
Microcontrollers and Processors » Microcontrollers

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Compare P89LPC9321FN,112 with alternatives