P89C660HBA vs P89C51RC2HFBD feature comparison

P89C660HBA NXP Semiconductors

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P89C51RC2HFBD NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LPCC QFP
Package Description PLASTIC, MS-018, SOT-187-2, LCC-44 10 X 10 X 1.40 MM, PLASTIC, LQFP-44
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J44 S-PQFP-G44
Length 16.5862 mm 10 mm
Number of I/O Lines 32 32
Number of Terminals 44 44
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Equivalence Code LDCC44,.7SQ QFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 16384 32768
ROM Programmability FLASH FLASH
Seated Height-Max 4.57 mm 1.6 mm
Speed 33 MHz 33 MHz
Supply Current-Max 64 mA 76 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 16.5862 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Samacsys Manufacturer NXP

Compare P89C660HBA with alternatives

Compare P89C51RC2HFBD with alternatives