P89C51RC2HFBD
vs
P89C664HBBD
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Package Description |
QFP, QFP44,.47SQ,32
|
QFP, QFP44,.47SQ,32
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
8051
|
JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
JESD-609 Code |
e0
|
e3
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP44,.47SQ,32
|
QFP44,.47SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
512
|
2048
|
ROM (words) |
32768
|
65536
|
ROM Programmability |
FLASH
|
FLASH
|
Speed |
33 MHz
|
33 MHz
|
Supply Current-Max |
76 mA
|
64 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Base Number Matches |
2
|
2
|
|
|
|