P89C51RC2BA
vs
P89C51RC2BA/01
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC44,.7SQ
|
LDCC44,.7SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
512
|
| ROM (words) |
32768
|
32768
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
33 MHz
|
33 MHz
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
LCC
|
| Package Description |
|
QCCJ, LDCC44,.7SQ
|
| Pin Count |
|
44
|
| ECCN Code |
|
3A991.A.2
|
| Factory Lead Time |
|
28 Weeks, 6 Days
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
16
|
| Clock Frequency-Max |
|
33 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
8
|
| Length |
|
16.5862 mm
|
| Number of I/O Lines |
|
32
|
| On Chip Program ROM Width |
|
8
|
| PWM Channels |
|
YES
|
| Seated Height-Max |
|
4.57 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
5 V
|
| Width |
|
16.5862 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|
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