P89C51RC2BA
vs
P89C51RD2BA/01,512
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
LCC
|
LCC
|
Package Description |
QCCJ, LDCC44,.7SQ
|
PLASTIC, SOT-187-2, LCC-44
|
Pin Count |
44
|
44
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
8051
|
Clock Frequency-Max |
33 MHz
|
33 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
Length |
16.5862 mm
|
16.5862 mm
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
44
|
44
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC44,.7SQ
|
LDCC44,.7SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
512
|
1024
|
ROM (words) |
32768
|
65536
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Speed |
33 MHz
|
33 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
5 V
|
5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
16.5862 mm
|
16.5862 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
3
|
1
|
|
|
|
Compare P89C51RC2BA with alternatives
Compare P89C51RD2BA/01,512 with alternatives