P87C52X2BN,112
vs
P89LV51RC2FA,512
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
LPCC
Package Description
0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40
QCCJ, LDCC44,.7SQ
Pin Count
40
44
Manufacturer Package Code
SOT129-1
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Has ADC
NO
NO
Additional Feature
ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
CPU Family
8051
8051
Clock Frequency-Max
33 MHz
33 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
S-PQCC-J44
JESD-609 Code
e3
Length
52 mm
16.5862 mm
Moisture Sensitivity Level
1
3
Number of I/O Lines
32
32
Number of Terminals
40
44
On Chip Program ROM Width
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP40,.6
LDCC44,.7SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
256
1024
ROM (words)
8192
32768
ROM Programmability
OTPROM
FLASH
Seated Height-Max
4.7 mm
4.57 mm
Speed
33 MHz
33 MHz
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
5 V
3 V
Supply Voltage-Nom
5 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
16.5862 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
ECCN Code
3A991.A.2
Peak Reflow Temperature (Cel)
245
Supply Current-Max
30 mA
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