P83C508NBPN vs P83C508NBBBD feature comparison

P83C508NBPN NXP Semiconductors

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P83C508NBBBD NXP Semiconductors

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Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP QFP
Package Description DIP, LQFP,
Pin Count 40 44
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature ON-CIRCUIT EMULATION ON-CIRCUIT EMULATION
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 33 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PDIP-T40 S-PQFP-G44
Length 52 mm 10 mm
Low Power Mode YES YES
Number of DMA Channels
Number of External Interrupts 2 2
Number of I/O Lines 32 32
Number of Serial I/Os 1 1
Number of Terminals 40 44
Number of Timers 2 2
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LQFP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
RAM (words) 256 256
ROM (words) 32768 32768
ROM Programmability MROM MROM
Seated Height-Max 4.7 mm 1.6 mm
Speed 33 MHz 33 MHz
Supply Current-Max 57.5 mA 57.5 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL QUAD
Width 15.24 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1

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