P83C508NBPN
vs
P80C52X2FA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
LPCC
Package Description
DIP,
PLASTIC, MS-018, SOT-187-2, LCC-44
Pin Count
40
44
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
ON-CIRCUIT EMULATION
ALSO OPERATES AT 2.7V MIN SUPPLY @ 16MHZ
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
33 MHz
33 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-PDIP-T40
S-PQCC-J44
Length
52 mm
16.5862 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of I/O Lines
32
32
Number of Serial I/Os
1
Number of Terminals
40
44
Number of Timers
2
On Chip Data RAM Width
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
256
ROM (words)
32768
8192
ROM Programmability
MROM
MROM
Seated Height-Max
4.7 mm
4.57 mm
Speed
33 MHz
33 MHz
Supply Current-Max
57.5 mA
0.05 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
16.5862 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Rohs Code
CPU Family
8051
Package Equivalence Code
LDCC44,.7SQ
RAM (bytes)
256
Compare P83C508NBPN with alternatives
Compare P80C52X2FA with alternatives