P80C52X2FN vs TS80C32-33 feature comparison

P80C52X2FN NXP Semiconductors

Buy Now Datasheet

TS80C32-33 Intel Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEL CORP
Part Package Code DIP QFP
Package Description 0.600 INCH, PLASTIC, MO-015, SOT-129-1, DIP-40 QFP-44
Pin Count 40 44
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature ALSO OPERATES AT 2.7V MIN SUPPLY @ 16MHZ BOOLEAN PROCESSOR
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 S-PQFP-G44
JESD-609 Code e3/e4 e0
Length 52 mm 10 mm
Number of I/O Lines 32 32
Number of Terminals 40 44
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QFP
Package Equivalence Code DIP40,.6 QFP44,.5SQ,32
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
ROM (words) 8192
ROM Programmability MROM
Seated Height-Max 4.7 mm 2.35 mm
Speed 33 MHz 33 MHz
Supply Current-Max 0.05 mA 56 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN/NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position DUAL QUAD
Width 15.24 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1

Compare P80C52X2FN with alternatives

Compare TS80C32-33 with alternatives