P4C198-35CMB
vs
5962-8685917LA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP,
DIP-24
Pin Count
24
Reach Compliance Code
compliant
unknown
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-CDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX4
16KX4
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
6
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Length
32.004 mm
Compare P4C198-35CMB with alternatives
Compare 5962-8685917LA with alternatives