P4C188-35PI vs 7188L25DB feature comparison

P4C188-35PI Pyramid Semiconductor Corporation

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7188L25DB Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP CDIP
Package Description 0.300 INCH, PLASTIC, DIP-22 DIP, DIP22,.3
Pin Count 22 22
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 25 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T22 R-CDIP-T22
JESD-609 Code e0 e0
Length 29.337 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 16KX4 16KX4
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP22,.3 DIP22,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.334 mm
Standby Current-Max 0.015 A 0.0006 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.15 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 3
Manufacturer Package Code CD22
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Screening Level MIL-STD-883 Class B

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