P4C170-35FSMB
vs
5962-8670519ZA
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
PYRAMID SEMICONDUCTOR CORP
|
Part Package Code |
DFP
|
|
Package Description |
DFP-20
|
DFP-20
|
Pin Count |
20
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
35 ns
|
JESD-30 Code |
R-PDFP-F20
|
R-CDFP-F20
|
Memory Density |
16384 bit
|
16384 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Number of Words |
4096 words
|
4096 words
|
Number of Words Code |
4000
|
4000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
4KX4
|
4KX4
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883
|
Seated Height-Max |
2.921 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
6.9215 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare P4C170-35FSMB with alternatives
Compare 5962-8670519ZA with alternatives