P4C1256L-70DMB vs 5962-9461108HYC feature comparison

P4C1256L-70DMB Pyramid Semiconductor Corporation

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5962-9461108HYC White Microelectronics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP WHITE MICROELECTRONICS
Part Package Code DIP
Package Description 0.300 INCH, CERAMIC, DIP-28 CERAMIC, QFP-68
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 25 ns
Additional Feature LG-MAX ALSO CONFIGURABLE AS 2M X 8
JESD-30 Code R-CDIP-T28 S-CQFP-F68
JESD-609 Code e0 e4
Length 37.719 mm
Memory Density 262144 bit 16777216 bit
Memory IC Type STANDARD SRAM CACHE SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 28 68
Number of Words 32768 words 524288 words
Number of Words Code 32000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 512KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QFF
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.715 mm 3.556 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm
Base Number Matches 4 1
Alternate Memory Width 16

Compare P4C1256L-70DMB with alternatives

Compare 5962-9461108HYC with alternatives