P4C1256L-55DI vs EDI88130LPS45FB feature comparison

P4C1256L-55DI Pyramid Semiconductor Corporation

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EDI88130LPS45FB Mercury Systems Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP MERCURY SYSTEMS INC
Part Package Code DIP
Package Description DIP, CERAMIC, DFP-32
Pin Count 28
Reach Compliance Code unknown unknown
Access Time-Max 55 ns 45 ns
Additional Feature LG-MAX
JESD-30 Code R-CDIP-T28 R-CDFP-F32
JESD-609 Code e0
Length 37.719 mm 20.828 mm
Memory Density 262144 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 32768 words 131072 words
Number of Words Code 32000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm 2.9464 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 10.414 mm
Base Number Matches 1 5
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Screening Level MIL-STD-883

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Compare EDI88130LPS45FB with alternatives