P4C1256-20FSMB vs 5962-8855213XA feature comparison

P4C1256-20FSMB Pyramid Semiconductor Corporation

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5962-8855213XA Micross Components

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP MICROSS COMPONENTS
Part Package Code DFP DIP
Package Description CERAMIC, FP-28 DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 12 ns
Additional Feature LG-MAX
JESD-30 Code R-CDFP-F28 R-GDIP-T28
JESD-609 Code e0 e0
Length 18.796 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B MIL-STD-883
Seated Height-Max 3.302 mm
Supply Current-Max 0.17 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm
Base Number Matches 2 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6

Compare P4C1256-20FSMB with alternatives

Compare 5962-8855213XA with alternatives