P1750AE-30CMB
vs
TS68C000VC12A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
BRAZED, DIP-64
|
SIDE BRAZED, CERAMIC, DIP-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
24
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
30 MHz
|
12.5 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-XDIP-T64
|
R-CDIP-T64
|
| Length |
42.2402 mm
|
81.28 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.191 mm
|
4.83 mm
|
| Speed |
30 MHz
|
12.5 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
22.86 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
DIP64,.9
|
| Supply Current-Max |
|
50 mA
|
|
|
|
Compare P1750AE-30CMB with alternatives
Compare TS68C000VC12A with alternatives