P1750AE-30CMB vs M38510/54001BYX feature comparison

P1750AE-30CMB Pyramid Semiconductor Corporation

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M38510/54001BYX Signetics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP SIGNETICS CORP
Part Package Code DIP
Package Description BRAZED, DIP-64 DIP,
Pin Count 64
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 16
Bit Size 16 16
Boundary Scan NO YES
Clock Frequency-Max 30 MHz 6 MHz
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Integrated Cache NO NO
JESD-30 Code R-XDIP-T64 R-XDIP-T64
Length 42.2402 mm
Low Power Mode NO YES
Number of Terminals 64 64
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.191 mm
Speed 30 MHz 6 MHz
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Screening Level MIL-M-38510 Class B

Compare P1750AE-30CMB with alternatives

Compare M38510/54001BYX with alternatives