P1750AE-20CMB
vs
M38510/54002BYC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
SIGNETICS CORP
Part Package Code
DIP
Package Description
BRAZED, DIP-64
DIP,
Pin Count
64
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
16
16
Boundary Scan
NO
YES
Clock Frequency-Max
20 MHz
8 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
NO
JESD-30 Code
R-XDIP-T64
R-XDIP-T64
Length
42.2402 mm
Low Power Mode
NO
YES
Number of Terminals
64
64
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.191 mm
Speed
20 MHz
8 MHz
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
Screening Level
MIL-M-38510 Class B
Compare P1750AE-20CMB with alternatives
Compare M38510/54002BYC with alternatives